StarTech.com 1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink
StarTech.com 1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink, 1.93 W/m·K, Silver, 0.12 °C/W, -30 – 180 °C, 67 mm, 10 g
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
Please see our support section for the Material Safety Data Sheet for SILVGREASE1.
The StarTech.com Advantage
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
|Thermal conductivity||1.93 W/m·K|
|Thermal resistance||0.12 °C/W|
|Operating temperature (T-T)||-30 - 180 °C|
|Evaporation (@ 200°C/24h)||0.001%|
|Bleed (@ 200°C/24h)||0.05%|
|Package width||84 mm|
|Package depth||151 mm|
|Package height||25 mm|
|Package weight||17 g|